Product Details

Suitable for optical lens, LED, IC, semiconductor, integrated circuit board, mobile hard disk and other semiconductor materials, glass filter and other UV film degumming. UV Tape UV Curing Systems is a UV film and cutting film adhesive tape viscosity reduction and removal of the adhesive fully automatic equipment. 6/8/12 inches Wafer Chip UV Film Degumming Machine 365nm is with bracket fixture device, with high efficiency of adhesive ability, can quickly reduce the viscosity of UV film affixed to the materials.

Parameters of Wafer Chip UV Curing Light Source:

Model : DSXUV-Tape-320

Outside dimension : 650*530*201mm

LED : NCSU033C 365nm UV LED

Cooling method : air cooling

Input power : 11-240V AC 50-60Hz

Total power : 370W

Lighting : bottom to the up

Function : can adjust time, intensity (0-100%)

Glass : quartz glass

Warranty : 1 year

Features of UV LED Curing Systems:

1.Small body, suitable for 6/8/10/12 inch wafer chip irradiation

2.Adjustable time and brightness, touch screen operation, simple and convenient

3.Bottom-up irradiation, convenient to place the wafer semiconductor chip

4.LED cold light source, environmental protection products, with low temperature, uniform exposure, compact structure, low energy consumption, is the ideal model of semiconductor industry, and low temperature has no damage to thermal materials

5.The service life is more than 10 times longer than ordinary mercury lamp, continuous service life of 15000-30000h

6.Zero maintenance cost, long term work without replacing the light source parts

7.Closed light source design, no UV side leakage, no damage to human body

8.The degumming speed is fast, it can be degumming in a few seconds

9.Can be compatible with small size