Product Details

Standard 12 inch Wafer Film UV Degumming Machine is suitable for degumming wafer, silicon wafer, glass, semiconductor components and other products. Perfect match with the sealing field of cutting, grinding, thinning process.

Information:

Name: Nitrogen UV Tape UV Curing Systems

Type: DSXUV-TapeN-12

Light source: SVC UV LED

Cooling Method: Fan cooling

Outside Dimension: L532*W552*H675mm

Use for Wafer Iron Ring: 12 inch and below

Operation: Touch screen operating

Gross weight: 75KG, including package

Characteristic: Nitrogen protection, real-time illumination monitoring