Product Details

Plastic Ring Wafer Film Mounting Machine, DSXUV accept customized various glass material film laminating machine, various UV tape blue film BG film laminating systems.

Note: the picture equipment is 8inch host, 6inch work plate, replaceable 8inch work plate. Work surface and work plate are with thickened Teflon. The biggest advantage is : protect the product, reduce the viscosity between the film and the table, easy to take.

Standard Model:

DSXUV-TapeM-6 is suitable for 6inch wafer chip

DSXUV-TapeM-8 is suitable for 8inch wafer chip

DSXUV-TapeM-12 is suitable for 12inch wafer chip

The manual wafer film laminator series is a fast and efficient laminator designed for wafer, glass, LED, PCB and ceramic cutting processes. The machine’s unique film saving design can greatly reduce the cost of film, and equipped with air flexible elastic (elastic adjustable) pressure roller and table design, not only can adapt to different thickness of the product can also minimize the film stress, so that the product is not hurt. Easy to use, no training required to get the started immediately.

Function:

1.Suitable for blue film, UV tape, PET substrate film, double layer film

2.Optional micro-porous laminating table for ultra-thin wafers

3.The heated and elastic laminating table is designed to adapt to wafers of varying thickness

4.Unique film roller pressure adjustable design

5.Equipped with circular knife and cross cutting knife

6.Optional electrostatic removal device for ion wind bar

7.Small size, tabletop layout

Anti-static Teflon surface treatment with heating and elasticity

The table design with heating and adjustable heating temperature range ensures that the adhesive effect of the film can be adjusted to the ideal state.

The elastic table adapts to wafers, glass or ceramics of different thicknesses

The antistatic Teflon treatment of the surface not only minimizes the static electricity generated during the coating, but also effectively prevents physical scratches on the chip.