Added time：2024-05-04
Product Details
Wafer Tearing Machine is a device used in the wafer preparation process in the semiconductor industry. In semiconductor manufacturing, wafers are usually made of silicon or other materials, and they are the base on which chips are made. During the preparation process, the wafer is usually covered with a protective film to protect the wafer surface from contamination, damage, or oxidation.
Wafer Film Remover Machine can efficiently remove the protective film on the wafer surface to ensure the quality and reliability of the wafer. The film tearing process is one of the important steps in semiconductor preparation and plays a key role in the success of the subsequent process steps.
Wafer Film Tearing Machine is used to remove the protective film on the wafer surface.
Parameters:
Wafer chip size | 6-12inch |
Wafer thickness | 100-800um |
Wafer fixation method | Vacuum absorption |
Working plate heating | 10-120℃ |
Working plate material | Aluminum, surface with teflon coated |
Tearing film | Blue film, UV tape, etc. |
Dimension | L433×W400×H334mm, wight: 40kg |
Tear film speed | 50s/pcs |
Operation panel | ON/OFF button |
Operation | Manual loading and unloading, manual film tearing. Option: action complete alarm prompt |
Electrostatic control | Keyence removes static ion fan, control the electrostatic <100V in the machine and during the film tearing process |
Compatibility | Support grinding thin wafer 6-12inch multi-table sharing |
Advantage:
1.Fast film tearing without bubbles
2.The work surface is treated with Teflon to ensure that the wafer is not damaged during the film tearing process
3.Heating range: normal temperature ~ 120 ℃, adjustable, temperature control accuracy: ±2 ℃
4.Ion fan (ESD) removes static electricity
The electrical part adopts SMC, Omron, Mitsubishi, Tianyi and other well-known brands or equivalent brands
Following Steps for Process of Film Tearing:
1.Loading wafer: Wafer tearing machines usually have a loading area for placing the wafer to be processed inside the machine. Wafers can be loaded individually or processed in batches
2.Alignment of wafers: Before the film is torn, the wafers need to be properly aligned to ensure that the ripping machine can accurately handle the surface of each wafer
3.Tearing film: Wafer Film Tearing Machines remove the protective film from the wafer surface using an appropriate tearing tool, such as a scraper or tearing film. Care should be taken when removing the film to avoid damage to the wafer surface
4.Discarded film: Teared film is collected for subsequent disposal or recycling
Unloading the wafer: The processed wafer is unloaded from the film tearing machine and ready for the next preparation stage
ADD：Room 401, Building 2, Shenjian Industrial Park, No. 183 Yongning Road, Zhangluo, Zhangmutou Town, Dongguan City
Email: 394413500@qq.com
Tel: 13823605006
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