Product Details

In the production process, in the use of the traditional ordinary curing machine, UV adhesive hardening processing speed is generally 30~40 seconds, curing time is long.

With the new generation of Deshengxing Cold Light Source LED UV Exposure Equipment, the curing time can be shortened to 3-5 seconds due to the accelerated reaction of UV wavelength and adhesive characteristics of the film. Therefore, this system is suitable for high speed of curing and can be used for R&D and mass production.

Application for Mini Ultraviolet Irradiation Machine Curing UV Film :

suitable for optical lens, LED, IC, semiconductor, wafer, integrated circuit board, mobile hard disk and other semiconductor materials UV film curing.

Host Parameters of UV LLED Exposure System Curing Semiconductor :

Size of Fixture Loading Slide Table :

Characteristics of UV Irradiation Chamber Curing Wafer :

1.Size of Wafer : 4 inches, 5 inches, 6 inches, 8 inches, 12 inches, can be customized other size.

2.The operator simple places / picks up the crop, everything else is fully automated.

3.Model is small, drawer type sliding door simple operation

4.Match the fixture that user needs

5.Imported LED UV light source, low temperature environmental protection, no noise and radiation, exposure uniformity, compact structure, low energy consumption, is the ideal model for the semiconductor industry